Capabilities
PCB Fabrication Capabilities
Board Size
Item | Standard Requirement | Special Requirement |
---|---|---|
Maximum panel size | 1 or 2 layers:400×450mm | |
610 x 1200mm Multilayer 450×550mm | 610 x 650mm | |
Maximum single board size | 1 or 2 layers:460×580mm | |
Multilayer :558×610mm |
Board Thickness
Item | Standard Requirement | Special Requirement |
---|---|---|
Minimum | 1 or 2 layers:0.2mm | |
Multilayer:4L : 0. 4mm 6L : 0. 8mm | ||
8L : 1.0mm 10L : 1.2mm 12L : 1.2mm | ||
Maximum | 1 or 2 layers:6.0mm | |
Multilayer:6.0mm | ||
Copper thickness | 0.5/1/2/3/4/5/6 Oz |
PTH & NPTH Holes
Item | Standard Requirement | Special Requirement |
---|---|---|
Minimum hole size | Board thickness≤2.0mm | |
Minimum hole 0.20mm | ||
Board thickness >2.0mm | ||
Aspect ratio ≤10:1 | ||
Maximum hole size | 6.0mm | 6.5mm |
Hole size tolerance for PTH holes | ±0.075mm | ±0.05mm |
Hole size tolerance for NPTH holes | ±0.05mm | ±0.05mm |
PTH Thickness
Item | Standard Requiremnts | Special Requirements |
---|---|---|
Minimum | 20um |
Line Width / Spacing
Items | Standard Requirements | Special Requirements | ||||||
---|---|---|---|---|---|---|---|---|
Inner Layer Line width/Spacing | Cu. (Oz) | Mils | Mils | |||||
0.5 | 4/4 | 4/4 | ||||||
1 | 5/5 | 5/5 | ||||||
2 | 7/7 | 6/6 | ||||||
3 | 9/9 | 8/8 | ||||||
4 | 11/11 | 10/10 | ||||||
5 | 13/13 | 11/11 | ||||||
6 | 15/15 | 13/13 | ||||||
Outer Layer Line width/Spacing | Cu. (Oz) | Mils | Mils | |||||
0.3 | 4/4 | 3/3 | ||||||
0.5 | 5/5 | 4/4 | ||||||
1 | 6/6 | 5/5 | ||||||
2 | 7/7 | 6/6 | ||||||
3 | 9/9 | 8/8 | ||||||
4 | 11/11 | 10/10 | ||||||
5 | 13/13 | 11/11 | ||||||
6 | 15/15 | 13/13 | ||||||
Inner Layer Spacing Between Holes and Traces | Mils | Mils | ||||||
Cu.(Oz) | 4-8L | 10-12L | 12L | 4-8L | 10-12L | > 12L | ||
0.5 | 8 | 10 | 14 | 7 | 8 | 12 | ||
1 | 8 | 10 | 14 | 8 | 10 | 12 | ||
2 | 10 | 12 | 15 | 8 | 12 | 13 | ||
3 | 12 | 16 | 16 | 10 | 12 | 14 | ||
4 | 14 | 18 | 18 | 10 | 14 | 14 | ||
Minimum Isolation Ring | 8 mils | 6 mils | ||||||
Minimum Annual Ring | Via Holes 6 mils | 4 mils | ||||||
component holes: 7 mils | 6 mils | |||||||
BGA solder points : 10 mils | 6-8 mils |
Surface Finishing
Item | Standard Requirement | Special Requirement |
---|---|---|
Surface Finishing | HAL (lead free), OSP, Immersion Gold | |
Immersion Silver, Immersion Tin | ||
Gold flash, Gold fingers | ||
Gold Flash | Nickel Thickness:100-200u” | |
Gold Thickness:1-50u” | ||
ENIG (Immersion Gold) | Nickel Thickness:80-150u” | |
Gold Thickness:1-3u” | ||
Gold Fingers | Nickel Thickness:120-150u” | |
Gold Thickness:1-40u” |
Etching
Item | Standard Requirement | Special Requirement | |
---|---|---|---|
Copper Thickness (Oz) | Tolerance +/- 20% | Tolerance +/- 10% | |
Width (mils) | Height (mils) | ||
0.3 | 8 | 40 | |
0.5 | 8 | 40 | |
1 | 10 | 40 | |
2 | 12 | 50 | |
3 | 14 | 60 | |
4 | 16 | 70 | |
5 | 18 | 80 | |
6 | 20 | 90 |
Soldermask
Item | Standard Requirement | Special Requirement |
---|---|---|
Color | Green, White, Black, Yellow, Red, Blue | |
Soldermask Opening | 2-4 mils | |
Soldermask Bridge | Minimum: 6 mils (Between IC pins) |
Silkscreen
Item | Standard Requirement | Special Requirement |
---|---|---|
Color | Green, White, Black, Yellow, Red, Blue | |
Width | 5 mils | |
Height | 30 mils |
Outline
Item | Standard Requirement | Special Requirement |
---|---|---|
Tolerance | ± 0.15mm | 0.1 mm |
V-Cut Depth | ± 0.1mm | |
V-Cut Drift Rate | ± 0.1mm | |
V-Cut Angle | 20, 30, 45, 60 degrees | |
The space between the line and the board Edge | Routing : 0.25mm | |
V-Cut : 0.4mm | ||
Minimum Board thickness for V-Cut | 0.6mm | 0.4 mm |
V-Cut size | Max. pnl size : 380 x 380mm | |
Min. pnl size: 50 x 80mm |
Material
Item | Standard Requirement | Special Requirement |
---|---|---|
Available in (House) | CEM-3, FR-4, High-TG, FR-4, FR-5 | |
Polymide, Teflon, AL5052 (Aluminum) | ||
Rogers 4 Series | ||
To be consigned | Arlon, Series, Taconic, Nelco | |
Rogers 5 & 6 Series |